PHONEFIX MECHANIC Solder Paste XG50 Sn63Pb37 Solder Paste Flux Mobile Phone PCB Repair For Solder Iron Station

Description

Item specifics

Brand Name: MECHANIC
Model Number: XG-50
Particle Size: 25-48µm
Item Name: MECHANIC Solder Paste Flux
Weight: 35-38g
Material: Plastic Bottle+Solder paste
Storage Condition: 0-10 Degree Celsius
Application: for BGA Soldering Iron Station Flux Cream
Function: for Phone Motherboard Welding Repairing Flux Cream
Alloy: Sn63/Pb37

Product Description

PHONEFIX MECHANIC Soldering Tin Cream XG-50 Sn63/Pb37 for SMT BGA Unleaded Welding Iron Station Flux Paste Soldering Repairing Tool Product Features
100% brand new and high quality.

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on good soldering and welding tool.

Unleaded MECHANIC BGA Solder Flux Paste Soldering Tin Cream Professional for BGA Soldering Iron Station.

Free lead solder paste, 183 ?, the degree of melting point, easy welding, easy molding.

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Product Specifications

Material: Plastic+solder paste.

Color: As picture shown

Type: XG-50 , 35g

Alloy: Sn63/Pb37.

Microns: 25-45um.

Application: for BGA motherboard soldering iron station flux cream.

Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.

Hi-Preformance.

Storage Condition:0-10°c.

? Note:
Harmful by inhalation and if swallowed.
Danger of cumulative effects.
Keep away from food,drink and animal feeding stuffs.
When using do not eat,Drink or smoke.
Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
Store container welll closed and cool.

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Packaging Details

Unit Type: piece
Package Weight: 0.09kg (0.20lb.)
Package Size: 10cm x 9cm x 8cm (3.94in x 3.54in x 3.15in)