Description
Item specifics
Brand Name: Riesba
Model Number: RMA-218
Particle Size: 25-48µm
Product Description
Promotions!! clear Kingbo RMA-218 bga Solder Flux Paste Solder 100g for SMT Reballing
The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
It is original made in Japan.
Good formula for BGA reballing / balls worksit can stick the balls much more.
List of items
1pcs *Kingbo RMA-218
Packaging Details
Unit Type: piece
Package Weight: 0.1kg (0.22lb.)
Package Size: 10cm x 5cm x 5cm (3.94in x 1.97in x 1.97in)
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